余英丰
教授
办公地点:上海市杨浦区淞沪路2005号复旦大学江湾校区化学-高分子楼B5096
办公电话:021-31242829
传真:021-31242888
电子邮箱:yfyu@fudan.edu.cn
课题组主页:yuyingfeng.polymer.cn
1990-1994,西安交通大学,化工学士
1994-1997,复旦大学,高分子硕士
1997-2001,西安惠特研究所,研发主管
2001-2004,复旦大学,高分子博士
2004-2006,复旦大学,讲师
2008-2009,西班牙罗维拉-威尔吉利大学,博士后
2007-2013,复旦大学,副教授
2013-至今,复旦大学,教授
电子封装材料的研究及开发
热固性聚合物材料的结构和加工流变、热、电、力学性能之间的关联研究
功能性高分子的合成及其应用
Zhang J, Li T, Hu Z, Wang H, Yu Y*, Effect of size and content of mesoscopic fillers on the polymerization induced viscoelastic phase separation. RSC Advances, 2014,4 (1): 442-454
Hu Z, Zhang J, Wang HP, Li T, Liu Z,Yu Y*. Dual effects of mesoscopic fllers on the polyethersulfone modified cyanate ester: enhanced viscoelastic effect and mechanical properties, RSC Advances, 2014, 4(66): 34927-37
Li T, Zhang J, Wang H, Hu Z, Yu Y*, High-Performance Light-Emitting Diodes Encapsulated with Silica-Filled Epoxy Materials. ACS Appl. Mater. Interfaces, 2013,5 (18): 8968-8981
Liu Y, Zhong X, Zhan G, Yu Y*, Jin J, Effect of Mesoscopic Fillers on the Polymerization Induced Viscoelastic Phase Separation at Near- and Off-Critical Compositions. J. Phys. Chem. B, 2012,116 (12), 3671-3682
Li T, Qin H, Liu Y, Zhong X, Yu Y*, Serra A, Hyperbranched polyester as additives in filled and unfilled epoxy-novolac systems. Polymer, 2012,53 (25): 5864-5872
Zhong X, Liu Y, Su H, Zhan G, Yu Y*, Gan W, Enhanced viscoelastic effect of mesoscopic fillers in phase separation. Soft Matter, 2011,7 (7): 3642-3650
Yu Y*, Zhong X, Su H, Serra A,Simultaneous cationic polymerization and esterification of epoxy/anhydride system in the presence of polyoxometalate catalyst. Polymer, 2010,51 (7): 1563-1571
Li L, Yu Y, Wu Q, Zhan G, Li S, Effect of chemical structure on the water sorption of amine-cured epoxy resins. Corros. Sci. 2009,51 (12): 3000-3006
Yu Y*, Su H, Gan W, Effects of Storage Aging on the Properties of Epoxy Prepregs. Ind. Eng. Chem. Res., 2009,48 (9): 4340-4345
Yu Y*, Wang M, Foix D, Li S, Rheological Study of Epoxy Systems Blended with Poly(ether sulfone) of Different Molecular Weights. Ind. Eng. Chem. Res., 2008,47 (23): 9361-9369